Rules for use of solder paste

Rules for use of solder paste

Abstract:

Use and preservation of tin paste

Solder paste use rule 1, the use of environmental temperature and humidity:

The storage temperature of solder paste is between 2-10℃, but in use, the recommended ambient temperature is 20-25℃, relative humidity is 30%-60%. Because the temperature is usually increased by 10℃, the speed of chemical reaction is about doubled, so the temperature is too high will improve the solvent volatilization rate of the solder paste and the reaction rate of FLUX and tin powder, so the solder paste is prone to dry; Too low temperature will affect the viscosity and expansibility of solder paste, easy to appear poor printing. At the same time, high humidity will also greatly increase the water vapor into the tin paste; However, low humidity will also affect the rate of solvent volatilization in the solder paste

High humidity is more likely to make the paste dry than too low humidity.

Solder paste use rule two, before use return temperature:

In order to slow down the reaction rate of FLUX and tin powder and prolong the storage time, tin paste is usually stored in cold storage (2-10℃). Before printing, the solder paste should be placed in a standard room temperature for temperature return. The standard 500g solder paste should be returned to the temperature for at least 2 hours, so that the temperature of the solder paste is the same as the ambient temperature. If the temperature return is insufficient, open the closed jar lid, which will cause water vapor in the air to condense and enter the tin paste because of the temperature difference, thus causing dry hair.