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Halogen-free solder paste
QH#LF97H(SnAg0.3Cu0.7)

QH#LF97H(SnAg0.3Cu0.7)

  • Product name: QH#LF97H(SnAg0.3Cu0.7)

    Product Description: Applicable Process

    1. Common common solder, mostly used in SMT welding process.

    2. For lead-free process.

  • Service Hotline:+86-769-85300736
  • Product parameters

modelQH#LF97HMetal content90.0±1%
melting point223℃Alloy compositionSnAg0.3Cu0.7
Tin powder particle size25-45umdiffusivity83.5%
Insulation resistance1.6×1012ΩCopper plate corrosion testPass
Product Features
High-quality printing and forming, clear and stable outline, 0.4mm spacing without kneading after 1 hour pause, printing speed 25-150mm/sec; thermal collapse is better than the maximum bridging spacing specified by IPC J-STD-005 standard, good diffusion , the residue is colorless
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