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Halogen-free solder paste
QH#LF98H(SnAg3.0Cu0.5)

QH#LF98H(SnAg3.0Cu0.5)

  • Product name: QH#LF98H(SnAg3.0Cu0.5)

    Product Description: Applicable Process

    1. Common common solder, mostly used in SMT welding process.

    2. It is suitable for welding through hole process.

    3. For lead-free process.

  • Service Hotline:+86-769-85300736
  • Product parameters

modelQH#LF98HMetal content90.0±1%
melting point217℃Alloy compositionSnAg0.3Cu0.5
Tin powder particle size25-45umdiffusivity85.5%
Insulation resistance1.5×1012ΩCopper plate corrosion testPass
Product Features
High-quality printing and forming, clear and stable outline, 0.4mm spacing without kneading after 1.5 hours of pause, printing speed 25-200mm/sec; thermal collapse is better than the maximum bridge spacing specified by IPCJ-STD-005 standard, good diffusivity, The residue is colorless and clear, and the pass rate for 10,000 online tests is greater than 97%.
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