Welcome,Dongguan Qihang Xiye Manufacturing Co.,Ltdwebsite
National Service Hotline:+86-769-85300736
Lead-free solder paste
QH#LF98(SnAg3.0Cu0.5)

QH#LF98(SnAg3.0Cu0.5)

  • 产品名称:QH#LF98(SnAg3.0Cu0.5)

    产品说明:适用工艺

    1、常见普通焊料、多用于SMT焊接工艺。

    2、适用于通孔工艺的焊接。

    3、用于无铅工艺。

  • Service Hotline:+86-769-85300736
  • Product parameters

modelQH#LF98Metal content90.0±1%
melting point217℃Alloy compositionSnAg3.0Cu0.5
Tin powder particle size25-45umdiffusivity85.5%
Insulation resistance1.5×1012ΩCopper plate corrosion testPass
Product Features
High-quality printing and forming, clear and stable outline, 0.4mm spacing without kneading after 1.5 hours of pause, printing speed 25-200mm/sec; thermal collapse is better than the maximum bridge spacing specified by IPC J-STD-005 standard, good diffusion , The residue is colorless and bright, and the pass rate of 10,000 online tests is greater than 97%.
Online feedback
Dongguan Qihang Xiye Manufacturing Co.,Ltd © Copyright 2022