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Lead-free solder paste
QH#LF96(SnCu0.7)

QH#LF96(SnCu0.7)

  • Product name: QH#LF96(SnCu0.7)

    Product Description: Applicable Process

    1. Common common solder, mostly used in SMT welding process.

    2. For lead-free process.

  • Service Hotline:+86-769-85300736
  • Product parameters

model QH#LF96 Metal content 90.0±1%
melting point 227℃ Alloy composition SnCu0.7
Tin powder particle size 25-45um diffusivity 83.5%
Insulation resistance 1.6×1012Ω Copper plate corrosion test Pass
Product Features
High-quality printing and forming, clear and stable outline, 0.4mm spacing without kneading after 1 hour pause, printing speed 25-150mm/sec; thermal collapse is better than the maximum bridge spacing specified by IPC J-STD-005 standard, good diffusion , The residue is colorless and clear.
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