model	QH#LT658	Metal content	90.0±1%
melting point	138℃	Alloy composition	Sn42Bi58
Tin powder particle size	25-45um	diffusivity	88.5%
Insulation resistance	1.5×1012Ω	Copper plate corrosion test	Pass

Product Features
High-quality printing and forming, clear and stable outline, after 1 hour of pause, the solder paste flows as smoothly as before, and the printing speed is 200mm/sec; thermal collapse is better than the maximum bridging distance specified by the IPC J-STD-005 standard, and the solder joints are shiny, Diffusion is excellent, and the residue is colorless and clear.